Wearable Robotic 3D Ultrasound
Co-founded iSono Health and led development of a wearable automated 3D ultrasound platform from early concept through clinical evaluation, FDA 510(k) clearance, manufacturing, and commercial deployment.
Electrical & Systems Engineer
RF / Analog · Mixed-Signal Electronics · Ultrasound · Embedded Systems · Robotics · Deep Tech
I build complex hardware systems from first principles, turning difficult technical concepts into working products.
Ph.D., Carnegie Mellon · RF & mixed-signal at Broadcom & Intel · Co-founder at iSono Health
My work spans the full system stack—from chip design, RF and analog performance, high-speed signal integrity, wired and wireless communications, power, and clocking to robotics, motion control, firmware, software, AI, safety, reliability, manufacturability, cost, and schedule.
Co-founded iSono Health and led development of a wearable automated 3D ultrasound platform from early concept through clinical evaluation, FDA 510(k) clearance, manufacturing, and commercial deployment.
Designed RF and mixed-signal circuits spanning Wi-Fi receiver architectures, millimeter-wave frequency synthesis, clocking, high-speed equalizers, and time-to-digital conversion across industry and academic research.
Developed acquisition and processing methods spanning ultrasound RF data capture, B-mode conversion, image enhancement, 3D reconstruction, volumetric visualization, and longitudinal analysis.
Led machine-learning efforts in lesion detection, segmentation, classification, image enhancement, and longitudinal volumetric measurement, including integration into clinical review workflows.
I’m an electrical engineer, technical founder, and system architect with experience spanning semiconductor design through complete commercial systems.
I earned my Ph.D. in Electrical & Computer Engineering from Carnegie Mellon University, worked on RF and mixed-signal ICs at Intel and Broadcom, and later co-founded iSono Health, where I helped build a wearable robotic 3D ultrasound platform.
I’m particularly interested in difficult engineering problems involving intelligent sensing, novel hardware, robotics, medical technology, human-machine interfaces, neurotechnology, and physical AI.